Loadport - N2 Purge Function

• High concentration purge (02<100ppm) is achieved at high speeds (within 2 minutes).
• High cleanliness for next generation semiconductor manufacturing. Non-contact seal structure (labyrinth and air seal) suppresses particle generation during door opening and closing and purge spreading particle inside FOUP regardless of the number of wafer due to blowing is suppressed by using RORZE's own purge plate.
• Installation for existing systems are in compliance with SEMI standards and it is possible to replace existing loadport with door opening and closing, and mapping. CID and E84 are also available on request.